尊敬的业内同仁，您好！

微纳（香港）科技有限公司诚挚地邀请您参加11月6日-8日在中国深圳·深圳坪山格兰云天国际酒店举办的第五届亚太碳化硅及相关材料国际会议。

在会议期间，微纳（香港）科技有限公司将在NO.10展台上展出最新产品和技术，我们诚挚地邀请您莅临展台，与我们进行深入的交流和探讨，共同探索合作与发展的可能性。

Distinguished delegates，

MICRO-NANO (HONGKONG) TECHNLOGY CO., LTD sincerely invite you to participate in the 5th Asia-Pacific Conference on Silicon Carbide and Related Materials (APCSCRM 2024)！

APCSCRM 2024 will be grandly held in Grand Skylight International Hotel Shenzhen Pingshan, China, on November 06-08, 2024, for better accelerating the academic research, technological progress and industrial upgrading of silicon carbide and other wide bandgap semiconductor industries in the Asia-Pacific region.

During the conference, MICRO-NANO (HONGKONG) TECHNLOGY CO., LTD will exhibit the latest products and technologies on booth NO.10. We sincerely invite you to visit our booth for in-depth exchanges and discussions, and explore the possibilities of cooperation and development together.

企业简介/Company profile

微纳（香港）科技有限公司(MNT)成立于2014年，是多家欧美日韩仪器供应商在中国的代理，主要负责中国的销售，技术支持与售后服务。产品涵盖外圆研磨、晶圆减薄、CMP化学机械抛光、CMP后清洗、晶圆颗粒度测量、磁控溅射热蒸发电子束蒸发镀膜、纳米压印、衍射器件光学参数测量机、光学散射仪、晶圆厚度翘曲度平整度检测机、匀胶机、湿法台、临时键合/解键合、扫描超声显微镜、微纳米压痕划痕仪、摩擦磨损试验机、快速退火炉、棱镜耦合仪等。

Micro-Nano (Hong Kong) Technology Co., LTD (MNT) was established in 2014. MNT's suppliers include SENTRONICS, G&N, Intego, Osiris and WITEC in Germany; CTS, ULTECH, PARK and JY Tech in KOREA; SCIL, TeraNova and NTS in Netherlands; NANOVEA in the USA, Korvus in the UK and Powatec in the Switzerland. And MNT has the product ranges of Grinders, CMP, POST CMP CLEANER, WAFER METROLOGY SYSTEM, NANOIMPRINT SOLUTIONS, SAM, RTP, 3D Optical Profilometers, Confocal Raman Microscopy, Film thickness and roughness measuring instrument, Atomic Force Microscopy (AFM), Roughness, Nanoindentation, Scratch testers, Tribometers, Digital Microscopy, CVD, Thermal evaporation, Sputtering, Etching system, Nanoindentation, Scratch testers, Tribometers, etc.

产品简介/About Production

一、德国SENTRONICS 晶圆厚度测试系统

SENTRONICS Modular Wafer Metrology System (Germany)

样品尺寸：4寸，6寸，8寸，12寸；

采用红外光谱技术，要用于测量晶圆的厚度、TTV、Bow、Warp以及wafer上各层薄膜厚度；

采用白光干涉技术，可得到wafer表面的3D形貌，表面粗糙度，TSV等关键尺寸，测量范围为0-100um，分辨率为亚纳米水平。

Wafer size: 4 inches, 6 inches, 8 inches, 12 inches;

Using infrared spectroscopy technology, it is used to measure the thickness of the wafer, TTV, Bow, Warp and the thickness of each layer of film on the wafer;

Using white light interferometry technology, the 3D morphology, surface roughness, TSV and other key dimensions of the wafer surface can be obtained, with a measurement range of 0-100um and a resolution of sub-nanometer level.

二、韩国CTS CMP化学机械抛光系统

CTS CMP (Korea)

样品尺寸：4寸，6寸，8寸，12寸；

采用气囊加载模式，分区压力控制（8寸以下分3区，12寸分5区）；

抛光垫修整器分区控制修整（8寸以下分10区，12寸分13区）；

采用直驱线性电机，性能远远优于传统的伺服电机;

片内非均匀性WIWNU 1sigma，去边5mm< 5%;

片间非均匀性WTWNU 1sigma，去边5mm< 3%;

Wafer size: 4 inches, 6 inches, 8 inches, 12 inches;

Airbag loading mode, zone pressure control (3 zones below 8 inches, 5 zones for 12 inches);

Polishing pad dresser zone control dressing (10 zones below 8 inches, 13 zones for 12 inches);

Direct drive linear motor, performance far superior to traditional servo motor;

Intra-chip non-uniformity WIWNU 1sigma, edge removal 5mm < 5%;

Inter-chip non-uniformity WTWNU 1sigma, edge removal 5mm < 3%;

三、德国OSIRIS湿法台、CMP后清洗机、匀胶机、喷胶机、显影机、刻蚀机、热板

OSIRIS Cleaning, Post CMP Cleaner, Spin Coater, Spray Coater, Developer, Wet Etching, Hotplate (Germany)

兼容2/4/6/8/12寸晶圆；

手动/全自动（带机械臂/Cassette）可选；

极高的均匀性及稳定性（匀胶设备均匀性＜1%，湿法刻蚀设备均匀性＜3%）；

湿法刻蚀/清洗设备集成自动混液系统

Compatible with 2/4/6/8/12-inch wafers;

Manual/fully automatic (with robot/Cassette) optional;

Extremely high uniformity and stability (uniformity of coating equipment <1%, uniformity of wet etching equipment <3%);

Integrated automatic liquid mixing system for wet etching/cleaning equipment

联系方式/Contact:

微纳（香港）科技有限公司

MICRO-NANO (HONGKONG) TECHNLOGY CO., LTD

邮箱/Email：

info@mnt-china.cn

电话/Tel:

010-87771242/ 裴经理15801657153

地址/Address：

北京经济技术开发区荣华路南路大族广场T4-504

T4-504, Dazu Square, Ronghua Road South, Beijing Economic and Technological Development Zone

关于会议/About APCSCRM2024

一、会议名称/Conference：

“芯时代开放创新·芯机遇合作发展”--第五届亚太碳化硅及相关材料国际会议

Open·lnnovation·Collaborative· Development——the 5th Asia-Pacific Conference on Silicon Carbide and Related Materials (APCSCRM 2024)

二、时间地点/Date&Venue：

时间：2024年11月6日—11月8日

地点：中国·深圳，深圳坪山格兰云天国际酒店

Date: Nov.6th,2024--Nov.8th,2024

Venue: Grand Skylight International Hotel Shenzhen Pingshan & Yanzi Lake International Convention and Exhibition Center

Location: No.36 Ruifing Road, Pingshan District, Shenzhen, Guangdong, China

三、组织机构/Organization：

四、会议安排/Schedule：

五、赞助单位/Sponsors：

六、会议官网/Website：

https://apcscrm2024.casconf.cn/

七、报名参会/Registration：

扫码立刻报名

Scan to Register